GOTSolar

Patent: Inorganic hole conductor based perovskite photoelectric conversion device with high operational stability at long term

A patent entitled “Inorganic hole conductor based perovskite photoelectric conversion device with high operational stability at long term” was filled on 3 May 2018 with reference WO/ 2018/203279. This invention relates to the introduction of a spacer layer in a Perovskite Solar Cell comprising organic-inorganic perovskite and an inorganic hole conductor as HTM, in particular CuSCN improves the performance of a PSC having an inorganic hole conductor. A spacer layer comprising reduced graphene oxide (rGO) between the metal or back contact of the device and the HTM layer comprising inorganic hole conductor prevents the dramatic loss of PCE of such PSCs after a treatment of continuous illumination and thermal stress. The presence of such spacer layer improves the long-term stability of a PSC comprising inorganic hole conductor to the point that the stability of such a device surpasses the stability of spiro-OMeTAD based PSCs.

More details about this patent can be found here: WO/2018/[email protected]

Patent: Laser-assisted encapsulation process and product thereof

A patent entitled “Laser-assisted encapsulation process and product thereof” was filled on 26 December 2017 with reference WO/2017/221218. This patent discloses a laser-assisted encapsulation in which a hermetic seal is formed through melting of an intermediate bonding layer by a laser beam, connecting two substrates to each other. This technique can be applied to temperature sensitive electronic devices, where the laser-assisted sealing is performed with substrates at room temperature, namely up to 150 °C. At least one of the substrates must be transparent at the wavelength of the laser and the bonding material is a paste meltable at a sufficiently low temperature, mainly composed of glass particles (glass frit), metal particles or composite materials made of glass and metal, or mono- or multi-layer metal films to provide strong adhesion and plasticity to the intermediate bonding layer.

More details about this patent can be found here: WO/2017/[email protected]