Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates

Seyedali Emami, Jorge Martins, Luísa Andrade, Joaquim Mendes, Adélio Mendes

DOI: 10.1016/j.optlaseng.2017.04.006
First published online 12 May 2017.
Paper at Publisher's website (available in Open Access)

Room temperature and low temperature (120°C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of <5×10⁻⁸ atm cm³ s⁻¹, maintaining its leak rate even after standard climatic cycle tests. Small size devices were bonded at room temperature while larger areas were sealed at the process temperature of 120°C. The sealing parameters were optimized through response surface methodology that makes the process capable for further development regardless of device size.